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Laird 607 thermal pad

Key specifications

Thermal interface type
Термопрокладка

Description

Laird 607 is a thermal pad for transferring heat from an electronic component to a heatsink. It is used around memory, power controllers and other hardware where a soft gap filler is required. Check the exact sheet thickness and dimensions before installation.

Laird 607 thermal pad
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Details are being confirmed with the store and will be added before launch.