GD900 Thermal Paste

Description

GD900 is a gray thermal compound that fills microscopic gaps between a processor, graphics chip, or another heat-generating component and its cooler. Rated thermal conductivity is 4.8 W/(m·K), density is above 2.3 g/cm³, and the operating range is −50 to +240 °C. The compound is electrically non-conductive and should be spread in a thin, even layer over clean, dry contact surfaces.