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GELID 1.5 mm thermal pad

Key specifications

Thermal interface type
Термопрокладка
Thickness
1.5 mm
Thermal interface electrical properties
Electrically non-conductive

Description

The 1.5 mm GELID thermal pad fills the gap between a heat-generating component and its heatsink. It suits memory, power components and other areas that need even contact with cooling hardware. The original pad thickness should be checked before installation.

GELID 1.5 mm thermal pad
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Details are being confirmed with the store and will be added before launch.